During the LED packaging process sulfide mainly occurs in solid crystal and dot glue packaging processes. The main sulfur is mainly silver -containing materials (silver -plated brackets and conductive silver glue) and silicon rubber materials. Silver -containing materials are sulfidized, which will generate black silver sulfide, causing yellowing and blacking in the sulfurized area; silicon gum materials will cause \"poisoning\" of silicone, causing solidification and cannot be completely solidified.其中硅膠固化劑的中毒：LED封裝用有機(jī)硅的固化劑含有白金(鉑)絡(luò)合物，而這種白金絡(luò)合物非常容易中毒，毒化劑是任意一種含氮(N)、磷(P ) The compound of sulfur (s), once the curing agent is poisoned, the silicon curing is incomplete, which will cause a high line expansion coefficient and increase the stress.

In terms of the packaging process of patching beads, the materials that may be vulcanized during the production process are:

1. The solid crystal process: the silver -plated bracket is vulcated, the bracket hair is yellow and black, and the luster will lose its luster.導(dǎo)致可靠性降低;

2.固晶工序：銀膠被硫化，銀膠發(fā)黑，顏色暗淡，會(huì)導(dǎo)致可靠性降低或失效;

3.固晶工序：硅性質(zhì)固晶膠被硫化， As a result, it cannot be completely solidified and cannot be completely solidified, which will cause the bonding force to decrease or fail;

4. Point glue, pink, and packaging process: Silicon -based dot powder is vulcanized, which will cause solidification and cannot be completely solidified, and the product will fail;

LED packaging plant, in the process of LED lamp beads, must pay great attention to the vulcanization prevention of these two links. Other LED supporting materials can be required to provide manufacturers with LED accessories sulfur drainage/bromo/chlorine detection reports provided by the manufacturer to confirm whether it contains sulfur, halogen and other substances to prevent it from chemical or physical reactions with LED materials, causing causing it LED products are corrosive, LED silicone, and fluorescent powder material properties are mutated, resulting in failure of LED photoelectric performance.

3. Use desulfurization gloves, finger covers, sulfur -free masks; distinguish sulfur -free materials, box clamps; Use sulfur -free cleaning agent; cleaning of sulfur PCB plates and use of desulfurization before use; set dedicated sulfur -free ovens, use products separately, and bake independently. Sn, SN, PB, HG, SB, BI, AS and other heavy metal ionic compounds; organic organic compounds containing unsaturated groups such as acetylene group. <7)的車間環(huán)境中。含氮酸性氣體會(huì)先與銀反應(yīng)，再與硫/氯/溴元素發(fā)生置換反應(yīng)生成的黑色的硫化銀、氯化銀或溴化銀。

? Epoxy resin, polyurethane resin: amine, isocyanate lipid curing agent

? Comprehensive organic silicon RTV rubber: Especially using SN catalyst

? soldering